Custom Devices

Are you looking for an innovative and customized solution for your technological product?

Our Company has over 30 years of experience in the microelectronics sector and in the design and manufacture of electronic sensors. We are the ideal partner for the development of hybrid microsystems and multi-parameter sensors tailored to meet the specific needs of each customer.

Do you have specific needs?

Do the standard versions of the products not fully meet your needs? Optoi team is available to develop tailor-made solutions, adapting functionality, protocols or monitored parameters according to your specific project needs.

Contact us to find out how we can support you with expertise and flexibility.

Microsystems and hybrid devices

Hybrid microsystems are a technology that integrates several functionalities into a single solution, often combining mechanical, microelectronic, and electronic elements. These, in most cases, are solutions designed in partnership with the customer and therefore are custom and exclusive solutions. Optoi has developed, for example, flex PCBs on which are mounted light sources, detectors and electronics for driving and signal acquisition/analysis. The flex PCB is then mounted on the customer's mechanical supports.

Multi-parameter sensors

Optoi designs and manufactures multi-parameter sensors developing custom solutions. Multi-parameter sensors are optimized to simultaneously measure multiple parameters in a single operation. In recent years multi-parameter sensors have been developed for some industrial partners Thanks to the company’s know-how and electronic and microelectronic skills, these sensors are characterized by customized design. Optoi designs, develops and supplies silicon devices. The Company has great experience and expertise in the so-called back-end (or microelectronic assembly), a process implemented entirely in the Company. This allows, for example, to mount optical filters on the surface of the detector or to implement chip-on-board technology. This technology eliminates the use of a package for individual devices by mounting semiconductor dice directly on the PCB of the final product. The result is a less expensive, lighter, and more compact finished product.

All products