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Our staff is currently working in collaboration with microelectronic labs and
integrated circuits fabline.
The silicon devices can be designed and produced using dedicated tools and
microelectronic equipments that are available thanks to official agreements
with our partners.
Silicon devices can be supplied in wafer or die shape. Complete process or single
microelectronic step can be offered, from layers deposition to ion implantation,
from litography to thermal diffusion and activation cycle.
Parametric and functional testing on wafers are available.
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