Optoi is your partner for microelectronics packaging service

Thanks to our in-house packaging line, we are the right partner to offer microelectronic assembly service to our customers.

Our technologies and know-how are focused on the following items:

• Wafer or substrate dicing
• Die bonding
• Wire bonding
• Glob Top
• Hermetic encapsulation

We are able to offer several kind of assembly solutions, among which:

• COB (Chip On Board)
• MCM (Multi Chip Module)
• SMD (Surface Mounted Device)
• CSP (Chip Scale Package)
• Stack 3D