TOTeM

The TO Test Machine is an internal project whose aim is to build an automatic test machine for components housed in TO packges.

We are currently seeking for experts and people in general who posses the knowledge about vibrational sorting techniques, Automatic Test Equipments (ATEs), and robots in order to improve the test procedures of our products.

Please, get in contact with Mr. Nicola Battisti.

Suppliers of Electronics Dies

Dealing with chips and dies in the microelectronic arena is a tough job. Despite the broad number of applications, attaining a chip is most of the times a challenge against price, Minimum Order Quantities (MOQs), and, of course, time. We are always searching for die suppliers who can reduce our time-to-market coefficient.

Please, get in contact with Mrs. Ketty Paller.

Partnership for Microelectronic Packaging

Dual Inline Packages (DIPs), Plastic Leadless Chip Carriers (PLCCs), Quad Flat Packs (QFPs), Transistor Outline metal-can packages (TOs), Thin Shrink Small Outline Packages (TSSOPs). The list of package shapes seems to be endless and limited only by engineers' immagination. We are available to estabilish alliances with other microelectronic packaging manufacturers.

Please, get in contact with Mr. Alfredo Maglione.

Commercial agents and distributors

Optoi is currently seeking distributors and commercial agents to collaborate with.

Please, get in contact with Mrs Ketty Paller.