Optoi staff has Know-How about Silicon Sensors, Microsystems,
Microelectronics, Packaging and Material Engineering.
A good competence has been reached on these
microelectronic products and services and, from several years, Optoi has
been successful in many projects and has gained good
expertise on several fields of application.
Regarding the microelectronic front-end, Optoi has the capability
to design its own microelectronic devices, thus having the
intellectual and the device property, and it produces them
with some integrated circuit fablines that are Optoi technological
partners and suppliers.
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An important strategic point concerns the fact that Optoi has a special production
agreement with the institute
ITC-irst,
a technologic centre that has a staff of more than 250 people and it is located close to Optoi.
A full equipped fabline is present and it is possible to start the process from
the prime material silicon wafers and to end it at the fully integrated wafers.
The microelectronic fabline is a class 10 clean room of 500 sqm, fully equipped with
the most important front-end technologies. After the front-end production, the
very important final step is the automatic 100% test on all the devices for all the
production wafers, just before the sorting and shipping to Optoi.
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The internal production of Optoi is based on the microelectronic
back-end technology. A fully equipped production line is working
for microelectronic packaging and testing, mainly focused on
silicon sensors and microsystems. The main technologies are specifically
dedicated to the production of industrial quantity of very small
microelectronic devices (die sizes from few mm to some cm). The
most important microelectronic packaging steps are fully automatic
and can be summarized in the following: wafers dicing, die bonding,
wire bonding or flip chip (now starting), glob top or other device
protection, encapsulation oven curing, single device cutting,
100% device testing, final sorting before shipment to
customers.
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