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Optoi staff has Know-How about Silicon Sensors, Microsystems, Microelectronics, Packaging and Material Engineering. A good competence has been reached on these microelectronic products and services and, from several years, Optoi has been successful in many projects and has gained good expertise on several fields of application.

Regarding the microelectronic front-end, Optoi has the capability to design its own microelectronic devices, thus having the intellectual and the device property, and it produces them with some integrated circuit fablines that are Optoi technological partners and suppliers.


An important strategic point concerns the fact that Optoi has a special production agreement with the institute ITC-irst, a technologic centre that has a staff of more than 250 people and it is located close to Optoi. A full equipped fabline is present and it is possible to start the process from the prime material silicon wafers and to end it at the fully integrated wafers. The microelectronic fabline is a class 10 clean room of 500 sqm, fully equipped with the most important front-end technologies. After the front-end production, the very important final step is the automatic 100% test on all the devices for all the production wafers, just before the sorting and shipping to Optoi.


The internal production of Optoi is based on the microelectronic back-end technology. A fully equipped production line is working for microelectronic packaging and testing, mainly focused on silicon sensors and microsystems. The main technologies are specifically dedicated to the production of industrial quantity of very small microelectronic devices (die sizes from few mm to some cm). The most important microelectronic packaging steps are fully automatic and can be summarized in the following: wafers dicing, die bonding, wire bonding or flip chip (now starting), glob top or other device protection, encapsulation oven curing, single device cutting, 100% device testing, final sorting before shipment to customers.